Job Details

Lead Packaging Substrate Engineer — Roadmap & Innovation

  2026-06-30     Apple, Inc.     San Francisco,CA  
Description:

A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits.#J-18808-Ljbffr


Apply for this Job

Please use the APPLY HERE link below to view additional details and application instructions.

Apply Here

Back to Search