Job Details

San Francisco Bay Area, California, United States Hardware

Join the team at the heart of memory innovation for every Apple product. As a DRAM Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of computation, power efficiency, and system integration through meticulous co-design between memory technology and our world-class SoCs. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.

Description

• In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple's future products.
• You will act as the central technical lead, guiding the roadmaps of our memory partners and collaborating with internal SoC and System teams to ensure flawless integration.
• Your ownership will span the entire product lifecycle, from initial architectural concept through qualification.

Responsibilities

• Determine the technical direction of next generation memory subsystems by analyzing package technologies and quantifying DRAM die and SoC trade-offs with silicon architects.
• Collaborate with cross-functional teams—including SoC Packaging, Design, SI/PI, and Thermal—to define memory component for optimized, system-level solutions.
• Solve complex electrical and mechanical integration challenges of memory packages incorporated into advanced packaging technologies such as CoWoS, EMIB, SoIC, and PoP.
• Define and document the memory package specifications, including architecture, layout, and bill of materials.
• Drive package failure analysis during qualification to ensure world-class quality and reliability.
• Partner with memory vendors, internal and industry stakeholders to develop roadmap for high-stack and 2.5D/3D memory package components.

Minimum Qualifications

• BS and 10 +years of relevant industry experience.

Preferred Qualifications

• MS and or Ph.D. with 10+ years of industry experience focused on HBM and high-performance memory.
• Deep expertise with HBM architecture: TSV design, die stacking (CoW/WoW), memory organization, pseudo-channels, and thermal management.
• Strong knowledge of package and silicon co-design principles for high-throughput interfaces (e.g., UCIe, D2D, HBM)
• Deep understanding of advanced memory packaging for DDR, LPDDR, HBM, and 3D integration thermal and mechanical challenges.
• Demonstrated ability to solve complex engineering tradeoffs using data-driven analysis.
• Excellent communication skills for collaborating with internal teams and managing external vendors.

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.

Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

Apple accepts applications to this posting on an ongoing basis.