Requires 5+ years of post‑grad experience, and is on‑site five days a week.
Responsibilities
Lead end‑to‑end development of advanced PCB system designs—from initial specifications through compliance validation—ensuring exceptional reliability and performance
Spearhead the design and deployment of high‑speed SerDes channels and complex high‑density BGA configurations, applying low‑loss materials to achieve optimal signal performance
Manage the creation and refinement of high‑power, low‑noise analog power architectures, DDR interfaces, and other essential electronic subsystems
Serve as a technical point of contact and mentor for ODMs, OEMs, and PCB/PCA manufacturing partners across domestic and international locations
Requirements
BS or MS in Electrical or related Engineering field with a minimum of 5+ years of experience designing and developing high‑speed hardware systems
Skilled in PCB design and layout using DxDesigner/OrCAD and Cadence Allegro
Deep knowledge of high‑speed board design practices, including SerDes channels, signal integrity fundamentals and power delivery optimization
Strong familiarity with industry‑standard interfaces such as PCIe, DDR, USB, SPI, and I²C, and their integration into full system designs
Experience with high‑density board design (at least 30+ layers)
Seniority level
Mid‑Senior level
Employment type
Full‑time
Job function
Computer Hardware Manufacturing, Semiconductor Manufacturing, and Computers and Electronics Manufacturing
Benefits
Medical insurance
Vision insurance
401(k)
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