3DIC Packaging SI/PI Applications Engineer at Siemens EDA (Siemens Digital Industries Software). The Application Engineer role is a critical role in Siemens EDA and, as an expert AE in the advanced packaging space, you will be at the forefront of one of today's most exciting, fast paced areas of hardware design. Customers face new challenges as the IC and Package/PCB worlds merge, and in this role, your engineering ingenuity will be critical to apply Siemens's portfolio of technologies to address the challenges these customers face.
As a 3DIC SI/PI Applications Engineer, you are responsible for driving the technical engagements with customers for Siemens SI/PI/EM analysis tools focused on the area of 2.5D/3D IC heterogeneous packaging. You will work collaboratively with a wide range of customers from startups to large enterprises with the objective of understanding their needs, mapping Siemens solutions to the customer problem, performing product demonstrations, and managing evaluations and benchmarks with customers. You will also help other AEs become familiar with these new packaging technologies and assist them in applying our solutions to this design space. You will provide guidance on technology trends in 2.5D/3D IC package analysis to Siemens R&D to ensure roadmaps align with customer needs.