Job Details

Overview

Join our team to lead the design and development of cutting-edge IC packaging solutions for advanced laser and opto-electronic ASIC chips. This role bridges hardware and manufacturing engineering, driving innovation from concept to production.

Base pay range

$150,000.00/yr - $180,000.00/yr

Location: San Francisco, CA (some travel required)

What You'll Do

• 50% Collaborate with hardware engineers on package design
• 50% Partner with manufacturing engineers to build and implement designs
• Act as the communication bridge between design and build teams
• Direct vendors producing components like substrates, epoxies, coated glass, PCBAs, and tooling

Responsibilities

• Own end-to-end IC package design, simulation, and development
• Collaborate across disciplines to build robust packages for harsh environments
• Transition prototypes to high-volume production
• Define reliability test plans and conduct failure analysis
• Manage sourcing, quoting, and low-volume orders

Required Skills & Experience

• 5+ years in semiconductor packaging or 2+ years with a relevant master's degree
• Proficiency in 3D CAD (SolidWorks) and FEA tools (ANSYS)
• Hands-on experience with die bonding, wirebonding, and optical alignment
• Familiarity with ceramic, CMOS, BGA, and organic substrates
• Wafer-level processing and failure analysis expertise
• Experience with optical systems (LiDAR, cameras, microscopes)

Plusses

• Degree in Materials Science, EE, ME, or related field
• Statistical analysis for volume production
• Automated microelectronic/photonic assembly experience

Details

• Seniority level: Associate
• Employment type: Full-time
• Job function: Manufacturing
• Industries: Manufacturing

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